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| Customization: | Available |
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| Application: | Adhesives, Electrical Insulation, Fire Resistance |
| Bonding Function: | Potting Adhesive |
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Property | Standard | Result | |
Appearance | Exquisite, uniform, no bubbles, no clumps, no gel, no crust,and no precipitate | Qualified | |
Part A Density (g/cm³) | 1.3±0.05 | 1.28 | |
Part B Density(g/cm³) | 1.0±0.05 | 0.98 | |
Slumpability(mm) | Vertical | ≤3 | 0 |
Horizontal | Non-deformation | Non-deformation | |
Break time(min) | ≤30 | 20 | |
Viscosity (mPa.s) | ≤4000 | 3200 | |
Tensile strength(MPA) | ≥1.0 | 1.18 | |
Maximum elongation (%) | ≥60 | 92 | |
Curing time(min) | ≥3.0 | 3.5 | |
Hardness (Shore A) | ≥40 | 50 | |
Thermalconductivityw/(m.k) | ≥0.3 | 0.3 | |
Dielectric constant1.2MHz | ≤3.3 | 3.2 | |
Dielectric breakdown strength(kV/mm) | ≥18 | 21 | |
Volumetric resistivity(Ω·cm) | ≥1.0x10^1 4 | 3.0*10^14 | |








